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This study evaluated room temperature creep properties of the intermetallic compounds (IMCs) formed at the interfaces between Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the commonly used electronic substrates (Cu, Ni and Ag) using nanoindentation. The creep stress exponent (CSE), representing creep resistance, in the decreasing order was Cu, Ni and then Ag based IMCs, which was in good agreement with...
Observations from assorted current stressing experiments on flip-chip solder joints imply that the Cu content in a solder joint system plays a dominant role in its electromigration reliability. In this paper, electromigration reliability of various flip-chip solder joint systems including different substrate pad finishes and solder compositions is summarized to demonstrate the effect of the Cu content...
Considering that the mechanical behavior plays a very important role in the packaging reliability, this study examined the shear deformation properties of pure Sn joints with different substrate materials and various gap sizes. The proeutectic Sn dendrites were refined and the shear strength was increased with a shrunken sample gap. The interfacial intermetallic compounds (IMCs) were thickened slightly...
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