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Inelastic thermal stress simulation was performed to evaluate effect of fiber cloths structures on thermal fatigue strength in through hole in PCB under cyclic thermal loads. Conclusions were shown as follows.
Through holes which were for electric signal communication were formed in printed circuit board. The surface of through hole was plated by thin metal and the irregularities were shaped on the free surface or on the interface due to hole-drilling process for making through holes in circuit board. Fracture of through hole was occurred by stress concentration due to its irregularity. In this study, inelastic...
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