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In this paper, we demonstrate three-dimensional assembly of nanoscale materials, including single-walled and multi-walled carbon nanotubes and Au nanoparticles on a flexible parylene-C substrate. The assembly technology combines top down fabrication (fabrication of the three-dimensional microplatform) and bottom up dielectrophoretic (DEP) assembly of different nanomaterials.
This paper reports a novel technological approach for three-dimensional (3D) assembly of gold nanoparticles with an average diameter of 52 nm using dielectrophoresis (DEP). To realize the 3D assembly, the authors have designed and fabricated a versatile self-aligned micromachined platform which is applicable for assembling metallic nanoparticles and nanostructures. The assembly process is achieved...
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