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Next generation white lighting and displays request a combination of high efficient RGB (Red, Green, Blue) or RGYB (Red, Green, Blue, Yellow) LEDs as opposed to current white LEDs fabricated using the "blue LED +yellow phosphor" approach. A white lighting source fabricated in either a RGB or a RGBY manner could potentially provide not only highest efficiency but also best colour rendering...
Flat panel displays (FPD) are becoming thinner and lighter, and edge-lit backlight modules are gradually replacing direct-lit devices. The number of LEDs is being reduced and high-power LEDs are increasingly being used for illumination. The effectiveness of free convection in the dissipation of heat generated from LEDs is limited in such constricted spaces, resulting in a loss of luminosity and a...
InGaN quantum dots at high densities (∼1011 dots/cm2) are demonstrated using metalorganic chemical vapor deposition combined with post growth processing of InGaN materials. Optical and structural studies are performed to characterize InGaN quantum dots.
Under an ultralow driven current density about 15 , a blue electroluminescence could be observed from the nanocrystalline n-ZnO/p-GaN heterojunction light-emitting diode. The photoluminescence spectrum showed a dominant sharp near-band-edge emission, and the deep-level emission of the nanocrystalline ZnO films was not observed. Current–voltage characteristics of the heterojunctions...
Chip attachment is an important step in packaging light-emitting diode (LED) chips. The attachment material provides mechanical support and heat dissipation. As high-power LED chips are targeted at general illumination applications, the thermal property of the die-attach material is critical to the light output and degradation of the lighting device. Silver epoxy, lead-free solder paste, and nanosilver...
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