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The intermetallic compounds formed during the reflow and aging of Sn-20In-2.8Ag ball-grid-array (BGA) packages are investigated. After reflow, a large number of cubic-shaped AuIn2 intermetallics accompanied by Ag2In precipitates appear in the solder matrix, while a Ni(Sn0.72Ni0.28)2 intermetallic layer is formed at the solder/pad interface. With further aging at 100°C, many voids can be observed in...