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This work was performed to investigate the effect of final surface finish of Cu electrodes on the adhesion and reliability of anisotropic conductive films (ACFs) joints. Two different materials, electroless Ni/immersion Au (ENIG) and organic solderability preservatives (OSPs), were selected because these materials has been most commonly used as the final surface finish materials in printed circuit...
In this paper, we investigated the degradation mechanism and the reliability behaviors of flip chip joint using anisotropic conductive adhesives (ACAs) and Au bumped chip under high current density. The current carrying capability and current stressing reliability of flip chip assembly using three different types of ACAs were performed to investigate the effect of thermal conductivity of ACA and the...
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