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For a limited solder volume interconnect structure, bump interconnect reliability is more sensitive to the growth behavior of the interfacial intermetallic compounds(IMCs). The study of the effect of solder cap thickness on the interfacial diffusion reaction is of great importance to the application of copper pillar bump. Here, we investigated the effect of different solder cap thicknesses on IMCs...
The purposed of this paper is to improve the corrosion resistance of connector application by plating ultrathin Ni-W film by reverse pulse current. Method of reverse pulse plating Ni-W alloy in the solution without Ni ion as well as the electrochemical behaviors of the plated thin film have been investigated. The results indicates that the corrosion resistance of the Ni layer is enhanced by the reverse...
Ultrasonic bonding based on Ni micro-nano cones array (MCA) was developed in this study. Interfacial morphologies of bonding joints were investigated. The deformation of nanocones demonstrated the complexity of initial indentation process. Analysis of morphology evolution under different bonding pressure revealed that interfacial voids shrinkage faster as pressure increase. The time dependent morphology...
0.1 μm soft gold film substrate was ultrasonic bonded with 0.6 mil gold wire, which effectively reduced gold assumption comparing to the traditional 0.3∼0.5 μm soft gold film substrate. The substrate showed good bondability by wire pull test (WPT) and perfect reliability by high temperature storage test (HTST). The bonding structure in failure mode of wire pull test was studied by focused ion beam...
Electromagnetic noise caused by high speed digital and radio frequency electronic devices can affect the normal operation of other devices within the same system and result in significant intra-system electromagnetic interference (EMI) problems. Conformal shielding is an emerging method to prevent EMI by using metallization techniques to coat a thin metal layer around the package. In this study, copper...
0.1 μm soft gold film substrate was ultrasonic bonded with 0.6 mil gold wire, which effectively reduced gold assumption comparing to the traditional 0.3∼0.5 μm soft gold film substrate. The substrate showed good bondability by wire pull test (WPT) and perfect reliability by high temperature storage test (HTST). The bonding structure in failure mode of wire pull test was studied by focused ion beam...
Electromagnetic noise caused by high speed digital and radio frequency electronic devices can affect the normal operation of other devices within the same system and result in significant intra-system electromagnetic interference (EMI) problems. Conformal shielding is an emerging method to prevent EMI by using metallization techniques to coat a thin metal layer around the package. In this study, copper...
Ultrasonic bonding based on Ni micro-nano cones array (MCA) was developed in this study. Interfacial morphologies of bonding joints were investigated. The deformation of nanocones demonstrated the complexity of initial indentation process. Analysis of morphology evolution under different bonding pressure revealed that interfacial voids shrinkage faster as pressure increase. The time dependent morphology...
In this paper, the formation and growth of intermetallic compounds (IMCs) of Sn-8Zn-3Bi-0.3Cr solder on Cu, Ni and Ni-W substrates have been investigated. For the Cu substrate, only Cu5Zn8 intermetallic compound was observed. For the Ni substrate, a Ni5Zn21 film formed at the interface due to the fast reaction between Ni and Zn. For the Ni-W substrate, a thin Ni5Zn21 film appeared between the solder...
Ni/Au microcones were fabricated and thermosonic bonded with Au wire. The thickness of Au film was only 0.05μm. The substrate with Ni/Au microcones showed good Au wire bondability with the average pull strength 4.85 gf and ball shear strength 54.33 gf. Microscopi observation showed that Ni/Au microcones were inserted into Au wire, thus physical interlock between the substrate and Au wire was formed...
An ideal low temperature bonding method was studied. Cu cones were prepared by electroless plating. Heating and pressure were used in the bonding process between Cu cones and Sn-3.0Ag-0.5Cu solder. It's a solid state bonding method because the bonding process was performed below the melting point of solder. Shear strength was measured by bonding tester. Morphologies of Cu cones, fracture surfaces...
An intelligent surface with Ni micro-nano cones array (MCA) was fabricated with electro-deposition method and exhibited super-hydrophilic nature when freshly prepared. Spontaneous transition from super-hydrophilicity to super-hydrophobicity was observed when the surface was exposed in air at room temperature. The special surface structure of MCA played an important role in amplifying the surface wettability...
Molded interconnect system (MIS) is a new generation of substrate technology for traditional QFN, and fine gold wire bonding should be used. While lots of studies focused on the wedge bonding process, the effect of Ni/Pd/Au finish on the bonding force was never verified before. This paper will present a detailed investigation on the wedge bonding on MIS leadframe, and many aspects which affect the...
Superhydrophobic nickel films were prepared by electrodeposition and electroless deposition without chemical modification. Experimental results reveal that the nickel film fabricated by electrodeposition is characterized with nanocone arrays and only has a contact angle of about 112°. By coupling electroless deposition, as the second step, hemispherically topped nanocones are generated and a high...
In this study, we used electroless deposition of NiP, NiWP on p-type Si as the barrier layer to prevent the diffusion of Cu into Si. We added different amount of W into the layer, wt% is 11.89% (NiWP-1) and 25.36% (NiWP-2). After annealed at various temperatures, thermal stability of the Si/Ni(W)P/Cu layers were evaluated by measuring the changes of resistance of the samples, using four-point probe...
The weak adhesion between the Epoxy Molding Compound (EMC) and Pd Preplated leadframes (Pd PPF's) often causes delaminations and reduces the reliability of integrated circuit. This paper reports on a practical method of dramatically improving the adhesion of EMC and Pd PPF's using electroplating shaped nickel layers. Button shear tests indicate that the adhesions between the EMC and three different...
Electroplating matte Sn has attracted much attention in the lead-free age. To prevent a growth of tin whiskers from lead-frame supported matte tin films, various mitigation methods have been reported. In this work, pure matte Sn was electroplated onto C194 alloy, and electroplating Ni film was used as barrier between matte Sn and lead-frame alloy. The microstructures of the Ni/Sn depositions and tin...
Electroplating metallization method for crystalline silicon solar cell was investigated with new diffusion barrier layer, Ni, crystalline NiW (c-NiW), amorphous NiW (a-NiW). After annealed at various temperatures, sheet resistance of Ni/Cu, c-NiW/Cu and a-NiW/Cu was measured to observe the Cu diffusion barrier performance. The rapid increase in sheet resistance of Ni/Cu contact indicated that Ni has...
Copper electrodeposited on nickel and copper alloys substrates is easy to be oxidized, and the adhesion between the oxides and substrates can be so poor that delamination happens at these interfaces, which may lead to an overall failure to the electronic device. In this work, three different substrates were prepared by applying direct current; of all these substrates the amorphous nickel-phosphorous...
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