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High-performance computing has been aggressively driving pitch and performance requirements for off-chip interconnections over the last several decades, pushing solder-based interconnections to their limits. The most leading-edge Cu pillar technology faces many fundamental challenges in scaling to pitches below 30um, in particular with stress management and increased risks of Au embrittlement as solder...
This paper presents the design analysis of low-profile transformers in 1-5kW DC-DC resonant converters. Recent advances in GaN devices are expected to improve the efficiency and power density of power converters, while the magnetics still remain the major bottleneck to miniaturization. A low-profile integrated magnetic component design that enables low-loss and high-power density is proposed for 400V/48V...
This paper presents the design and implementation of engineered nanoscale bonding interfaces as an effective strategy to improve manufacturability of Cu-Cu bonding to the level where it can, for the first time, be applied to chip-to-substrate (C2S) assembly. All-Cu interconnections are highly sought after to meet the escalating electrical, thermal, and reliability requirements of a wide range of emerging...
This paper describes an innovative approach to develop high density and ultra-thin solid aluminum capacitors for high voltage automotive applications that sustain high temperatures. Form factors of less than 100 µm thickness are achieved with densities of 16.85, 1.91, 1.13, and 0.705 µF/cm2, for capacitors anodized to 10, 100, 150, and 200 V respectively. The capacitors exhibit good frequency stability...
This paper demonstrates silicon-integrated, thinfilm, high-density tantalum capacitors for integrated power modules. The capacitors in form-factors of less than 75µm showed stable capacitance densities of more than 0.3 µF/mm2 with leakage of less than 0.1 µA/µF at 3 V. To the best of authors' knowledge, this is the highest capacitance density reported till date at the mentioned form-factors. Furthermore,...
This paper describes an innovative scheme for integrating thinfilm tantalum (Ta) capacitors on active silicon substrates, an approach that can serve as a roadmap for the potential integration of ultra-thin high density capacitors in near future. The paper describes a new 3D concept for ultra-miniaturized, multi-functional and relatively low-cost power converter modules. The scheme consists of planar...
This work reports synthesis, characterization and integration of sub-micron thick nano-grained barium titanate films on organic Printed Wiring Boards (PWB). Barium titanate films were synthesized on titanium foils at 95∘C. SEM of films revealed 80 nm grains. The films were characterized using XRD, FTIR and Raman spectroscopy. As-synthesized films exhibited high capacitance densities and dielectric...
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