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By launching new processes introduced by nano science into much more conventional industrial applications fast, robust and economical reasonable inspection methods are required for process control and quality assurance. Due to the complexity of processes e.g. for thin film coatings or nano engineered materials, variations of material parameters like microstructures, grain boundary conditions, particle...
The challenge of nano packaging requires new non-destructive evaluation (NDE) techniques to detect and characterize very small defects like transportation phenomenon, Kirkendall voids or micro cracks. Imaging technologies with resolutions in the submicron range are the desire. Possible evaluation methods are for example x-ray microscopy, x-ray tomography, ultrasonic microscopy and thermal microscopy...
The challenge of nano packaging requires new non-destructive evaluation (NDE) techniques to detect and characterize very small defects like Kirkendall voids or micro cracks. Imaging technologies with resolutions in the sub-micron range are desired. Possible evaluation methods are for example x-ray microscopy, x-ray tomography, ultrasonic microscopy and thermal microscopy. However, techniques with...
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