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Fan-Out Wafer Level Packaging (FOWLP) has recently seen a tremendous growth in a broad span of application in telecommunications, automotive and other markets. Its versatility allows its continuous development to accommodate more and more types of components. In light of expanding the technology to include new family of sensors such as MEMS/NEMS, Bio-chips with Microfluidics, magneto-resistive devices...
An autonomous, wireless multi-variable smart sensor is presented able to gather, validate, and locally process data on both position alignment and temperature in remotely-operated high-voltage disconnect switches, as part of an instrumentation system which, integrating small, smart, and deeply embedded “field” devices in large numbers, may address the data requirements placed by new sophisticated...
A multi-variable smart sensor is presented able to gather, validate, and locally process data on both temperature and tri-axial vibration, as part of an instrumentation system which, integrating small, smart, and deeply embedded ‘field’ devices in large numbers, may address the data requirements placed by new sophisticated Predictive Maintenance criteria applied to industrial rotating machinery.
In this demo we address an application of a Predictive Maintenance Industrial system, for the monitoring of rotating machinery, which integrates both wired and wireless sensors, which comprise a triaxial acceleration sensor and a temperature sensor, in an Hybrid Network of sensors. The emphasis of the demonstration will be in this dual existence of networks, all integrated in one monitoring system...
This paper addresses the condition monitoring and diagnostics of twelve-pulse load commutated inverter drive systems, focusing on the occurrence of faults of the open-switch type in the power converters. The results presented are based on different monitoring techniques, namely, mechanical vibrations, axial leakage flux and temperature measurements. The goal of this study is to analyse the variations...
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