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Thermal fields in film deposition chambers critically control the final uniformity of the film thickness in semiconductor manufacturing. Constructing simple, efficient and yet accurate enough models of the temperature fields is therefore crucial in effective fault detection and eventually, for film thickness uniformity controls. We explored one decomposition method of the temperature fields using...
Thermal fields in film deposition chambers critically control the final uniformity of the film thickness in semiconductor manufacturing. Constructing simple, efficient and yet accurate enough models of the temperature fields is therefore crucial in effective fault detection and eventually, for film thickness uniformity controls. We explored one decomposition method of the temperature fields using...
As critical dimensions of semiconductor devices shrink towards 10n and smaller, applications of advanced process control (APC) solutions no longer reap large reductions of observed variances as it used to behave, sometimes with bare improvements or even deteriorations, consequently raising disgruntlement of the management.
Accompanying heavy costs in sampling processes, many a time there are missing items in the collected data, whether the population may come from a great variety of sources: social, economical, or engineering. In semiconductor manufacturing, due to the inherent reentrant flows of product-mixes and tool-constraints, uneven distributions of populations give the norm of missing data [1,2] in all the samples...
This paper presents a detail investigation on the performances of adopting virtual metrology in applications of advanced process controls for the purpose of sampling reductions to cut down manufacturing costs. The intended application of virtual metrology is to replace hardware measurements instead of as digital gatekeeper or alarm-trigger of invoking advanced process controls. Whereas many feasibility...
This paper examines impacts of metrology delays on the system performances of advanced process control solutions in semiconductor manufacturing. The analysis establishes a first step in any assessment of sampling reduction, a persistent notion amid the relentless drives of cutting production costs. We show that metrology delays deteriorate system performances with increased variances but retain system...
This paper presents a case study of constructing process models based on physical mechanisms of semiconductor manufacturing tools in attempts to predict behaviours of process conditions. Actual measurements from the processing tools are always corrupted with noises and crunching huge volumes of temporal traces of status variables very often fail to pinpoint the accurate fault conditions, not to mention...
In a highly mixed-product running environment for semiconductor manufacturing, data availability is always a critical issue. With so many products being processed across groups of similar tools for the same process step, the accumulated runs of data block over time would look like that shown in Fig.1. It is very unlikely that one tool would process all the products, or one product would necessarily...
This paper presents a failure model of heating filaments as used in semiconductor manufacturing tools for growing epitaxial films. Attempts were endeavoured to provide feasible physical insights on the observations in changes of impedance as indirectly derived via readings of voltage-current measurements, instead of conventional data-driven black-box approach of statistical regressions. The proposed...
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