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For improvement of the productivity and the cost reduction, FOWLP (fan-out wafer level package) or FOPLP (fan-out panel level package) process using large-sized substrate has been actively developed in recent years. Above all, we will report about the novel TCB (thermal compression bonding) equipment which is even applicable to a 3D-IC stacking process and a fine pitch FOWLP or FOPLP of RDL-first...
As one of the methods to stack the 3D-IC fast, the collective bonding process using TCB (thermo-compression bonder) attracts attention [1-3]. In the collective bonding process, we can improve the throughput considerably by postbonding the multilayered pre-bonded chips at a time. However, when the number of the stacked chips increased, we found that the temperature difference between the upper layer...
The evaluation result of 4 layer stacked IC which was bonded using thermal compression bonder (TCB) is reported. The throughput can be remarkably improved because chips of multi-layer can be pre bonded by using non-conductive film (NCF) which is pre-applied adhesive and can be thermally pressed at a time. To realize this process, we stacked the 4 chips having through silicon via (TSV) on a Si substrate...
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