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Here we show, for the first time, a significant improvement of switching characteristics in a 1.2‐kV SiC Schottky barrier diode‐wall integrated trench MOSFET (SWITCH‐MOS) by the application of a Kelvin source (KS) connection. Turn‐on loss (Eon) was greatly reduced, with superior Eon‐dVDS/dt trade‐off characteristics at a moderate dVDS/dt value of about 10 kV/μs, because the SWITCH‐MOS with KS achieves...
Application of highly N-doped buffer layers or a (N+B)-doped buffer layer to PiN diodes to suppress the expansion of Shockley stacking faults (SSFs) from the epilayer/substrate interface was studied. These buffer layers showed very short minority carrier lifetimes of 30–200 ns at 250°C. The PiN diodes were fabricated with buffer layers of various thicknesses and were then tested under high current...
An epitaxial growth technique for 4H-SiC with B doping was developed to control the carrier lifetimes of the epilayers. A linear relationship was observed between the B doping concentration and the flow rate of tri-ethyl-boron, which was used as the B doping source. A room temperature photoluminescence spectrum of a N- and B-doped epilayer showed a broad B-related peak at 2.37 eV instead of a band-edge...
Epitaxial growth of 4H-SiC with intentional V or Ti doping was performed to obtain short minority carrier lifetimes, using VCl4 or TiCl4 as the doping sources. The doping efficiencies and quality of the epilayers were compared for H2+SiH4+C3H8 and H2+SiH4+C3H8+HCl gas systems. The addition of V or Ti in highly N-doped epilayer demonstrated very short minority carrier lifetimes of 20–30 ns at 250°C.
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