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We report a surface modification method to improve the filler-matrix interface in silica-epoxy composites. A double-layer modification scheme was used to coat silica with polysiloxane-based surface modifier molecules. The polysiloxane coating reaction was confirmed by SEM, DSC, and TGA analyses, and the coated silica exhibit good chemical compatibility with the epoxy matrix. The CTE of epoxy composite...
We report a novel surface modification method to improve the interfacial bonding and compatibility of nanosilica with epoxy matrix. This approach utilized a two-layer modification strategy that not only provides a layer of functional groups at the surface to match the surface energy of nanosilica with epoxy resin, but also generates a large filler-matrix interphase transition region by covalent bonding...
In order to enhance thermal conductivity of underfill materials, hexagonal boron nitride (h-BN) was employed as a thermally conductive filler. The relationship between the filler morphology and its effects on the thermal conductivity is focused in this study. Two different h-BN fillers with different morphologies were applied to generate an efficient thermal transport path through the filler and epoxy...
In this study, we have developed high dielectric constant (k>50) embedded capacitor dielectrics with a moderate volume fraction of tiller that show good adhesion, good thermal stress reliability and good large area processibility at low processing temperature (<200degC). Material design and processing are critical to obtain a high dielectric constant composite at a moderate filler loading. The...
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