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Bottom terminated electronic components can fail from contamination trapped under the device. Many devices are designed with large, uninterrupted solder mass and a low standoff height, which close off paths for flux to outgas during reflow. The surface tension effects and wetting properties of the flux within solder paste can underfill the device with active residue that bridges conductive paths....
Circuit / System PCB designer's objective is to increase device functionality in a smaller form factor with a higher density electronic layout. Higher density and smaller form factor components are driving the industry toward a higher risk situation in intermittent electronic performance. Voltage leakage and even current leakage can lead to signal integrity loss and even flip bit issues or drops in...
Reliability test methods are performed during the manufacturing design phase to validate process conditions, with a goal to build electronic assemblies that meet reliability and product life objectives. Contract manufacturers (CM) build to the original equipment manufacturers (OEM) cleanliness specification in an effort to meet quality, performance and reliability expectations. Manufacturing engineers...
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