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We design, fabricate and characterize a noble high sensitivity z-axis capacitive type MEMS accelerometer which has moving ground masses. The previous MEMS capacitive accelerometers detect the acceleration by measuring the capacitance change between fixed reference electrode and movable sensing electrode. However, capacitive MEMS accelerometer for sensing out-of-plane acceleration shows relatively...
This paper presents a simple and low-cost flip chip bumping method with vertical feedthroughs for MEMS WLCSP. The vertical feedthroughs are fabricated on glass wafer using sand-blasting, and these provide inherent aligning jig for micro-ball arrangement. The experimental evaluations using MEMS accelerometer are also presented. The proposed method can be a more cost-effective solution by eliminating...
In this paper, a bidirectional readout integrated circuit (ROIC) with capacitance-to-time conversion operation has been proposed and demonstrated for high performance capacitive micro-electro-mechanical system (MEMS) accelerometers, which is implemented by a 0.35-mum CMOS EEPROM process. For the desired performance of the proposed ROIC, a bidirectional time-to-digital conversion (TDC) method with...
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