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In the transition to lead-free process, one of the most prominent problems is the lead-free solder joint interconnection reliability. Interconnection failure analysis is an important tool for improving the lead-free PCBA product design as well as assembly process quality. Combining a typical fault case, this study deeply analyzed the failure phenomena and the failure mechanism as to interconnection...
Due to the promotion of the globalization of environmental protection process, some high reliability requirements of electronic products have to be passive to the backward compatible soldering process. Compared to the traditional Sn-Pb soldering process, the backward compatible soldering process has to face with a smaller process window and a higher process implementation difficulty. In this paper,...
In this paper, regarding the joint interfacial zone as a special region with serious heterogeneity on microstructure and mechanical property, a creep-fatigue interaction damage model was proposed, in which two parameters named as creep strain energy density and average equivalent stress were introduced, aiming to reflect the effect of interfacial microstructure evolution. Based on the proposed heterogeneous...
In the transition to lead-free process, one of the most prominent problems as the changes of packaging materials and process has brought about is the lead-free solder joint reliability. As material property degradation due to microstructure evolution under loading conditions is the main cause of solder joint failure, studying on damage behavior and failure mechanism of solder joints has a very important...
It is essential to understand that excessive strain usually results in various failure modes for printed circuit board assembly (PCBA) products. However, it is often difficult to measure the true strains of the critical component solder joints' connections on PCBAs directly. Based on analysis of the basic principle for strain gage test technology and strain-induced damage phenomena of PCBAs, this...
In this paper, a serious crack phenomenon of Backward Compatible Assembled BGA joint with reflow and waving process was found and solved by the optimization of soldering process. The quality of BGA solder joints was confirmed after optimization. The mechanism of such cracking was illustrated.
In this paper, a serious crack phenomenon of Backward Compatible Assembled BGA joint with reflow and waving process was found and solved by the optimization of soldering process. The quality of BGA solder joints was confirmed after optimization. The mechanism of such cracking was illustrated.
ANSI/ESD S20.20 and IEC61340 Standards provide a general framework for developing an ESD control program. However, proper implementation of the Standard has been problematic, resulting in issues in engineering practice. The current ESD protection situations and implementation of standards in China are investigated. Proposals are also put forward for improving factory ESD control.
The effects of multiple reflows and thermal shock on interfacial reaction of the solder joints between Sn-0.3Ag-0.7Cu solder/pads (HASL, OSP, electrolytic Ni/Au and ENIG PCB finishes) were systematically investigated in this work. The results showed that the scallop Cu6Sn5 phase were formed in HASL and OSP finish pads during reflows, whereas the cylinder-type (Cu, Ni)6Sn5 near the solder and needle-type...
The effect of adding Ti in Sn0.7Cu lead-free solder on the wettability and interfacial reaction between the solder and Cu substrate was investigated. The results show that the wettability can be improved by adding Ti in Sn0.7Cu solder, and the spreading area is increased by 5% compared with that of Sn0.7Cu solder. It is also revealed that the growth rate of the interfacial intermetallic compound (IMC)...
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