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The aim of this paper is investigation of the flow analysis, the thermal resistance, and the distribution of coolant inside multilayer LTCC (Low Temperature Co-fired Ceramics) with embedded channels for power electronic devices. For this purpose LTCC multilayer structures with integrated channel and thermal vias are designed, measured, simulated and realized. The impact of the volume flow rate of...
The following study brings an experience with visualization challenge of temperature fields distribution on power module through web interface. Solution is provided by students, bringing them a unique way of learning 3D graphics as well as working with related technologies. The visualization problem is solved using WebGL technology, allowing rendering of 3D scenes directly within web browser. The...
The paper describes the results of investigations concerning the behaviour and joint quality of various die attachment materials on DBC (Direct Bonded Copper) Al2O3 based substrates. A comparative study of influence of various material on joint quality was realized. Experimental samples were reflowed in a vacuum reflow oven, and in a vapour phase soldering (VPS) chamber. For the first time were applied...
The goal of this paper is to present the method for automatic detection and location of power chip, which is soldered on DBC substrate, and voids in die attach solder joint. The method of chip location is provided by two dimension correlation applied on X-Ray images. When chip location is detected, voids in solder joints can be detected. It is very important to make such analysis, because during soldering...
The contribution describes effective tools for practical education of PCB thermal analysis. Demonstration samples were created for practical exercises in the area of simulation and measurement of temperature fields on surface of PCBs. The appropriate tools are focused on demonstration of thermal dissipation possibilities and thermal interactions between power components and on practical problems of...
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