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Effective thermal transport is one of the bottlenecks for the development of next-generation IC packages. In this report, we use a thermally conductive yet electrically insulating metal-ceramic hybrid filler of aluminum-aluminum oxide to study the thermal enhancement in epoxy-based underfill material. Metallic aluminum has thermal conductivity of 237 W/m·K, and here we report our study on the effect...
Conductive filler-polymer composite materials have been extensively investigated as conductor-insulator percolative system to achieve high dielectric constant (K). Additionally, the effective dielectric constant of conductive filler/polymer composite can be dramatically enhanced by increasing the dielectric constant of polymer matrix according to scaling theory. However, the high dielectric loss of...
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