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In this paper, we report on the integration of laser-annealed junctions into a state-of-the-art high-k/metal gate process flow. After implant optimization, we achieve excellent Lg scaling of 15/30 nm over a spike reference, for nMOS and pMOS respectively, without any performance loss. This enables to fabricate transistors with Lgmin meeting the 32 nm node requirement. In addition, we highlight the...
This paper provides a comprehensive study of the abnormal PBTI behaviors recently observed in La/Dy-capped high-k films in low-VT nMOSFETs. We found that process details in thermal budget (or dielectric intermixing) and oxygen content of the metal trigger the onset of these abnormalities. The DeltaVT relaxation during the PBTI recovery period induced by bulk trapping/de-trapping is believed to be...
This work reports the first comprehensive evaluation of FUSI gates for manufacturability, covering the key aspects of integration, process control, reliability, matching, device design and circuit-level benefit. Thanks to a selective and controlled poly etch-back process, dual work-function Ni-based FUSI CMOS circuits with record ring oscillator performance (high-VT applications) have been achieved...
A comprehensive analysis of operational tall triple-gate MuGFET ring oscillators (ROs) is presented for the first time. Device geometries, process options and best inverter layout are discussed based on measured power and delay. A MOS model 11 based macro-model has been calibrated and correlated to hardware to enable a study on work-function tuning, conformal S/D extensions, strain engineering, raised...
We report record unloaded ring oscillator delay (17ps at VDD = 1.1V and 20pA/mum Ioff) using low power CMOS transistors with Ni-based fully silicided (FUSI) gates on HfSiON. This result comes from two key advancements over our previous report presented in A. Lauwers et al. (2005). First, we have improved the (unstrained) devices Idsat to be 560/245muA/mum for nMOS/pMOS at an Ioff = 20pA/mum and V...
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