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This paper focuses on Signal Integrity (SI) and Power Integrity (PI) integration characteristic research. The voltage fluctuation across the power supply of Integrity Circuit (IC) is called Simultaneous Switching Noise (SSN). The research emphasizes on the SSN generated from packages since the switching of I/O in chip. A CMOS inverter chip [1] is designed because of the simplicity of the model, the...
The research majored in the implementation of non-contacting near-field to far-field transformation. The emphasized methodology of transformation was according to the Kirchhoff surface integral representation (KSIR) having one of most outstanding advantages is that it could distinguish the six field independently on the basis of their each individual integral surface and simplify the complexity of...
The working voltage of the electronic products becomes lower, so the small variable of voltage is serious for the electronic products. The effects which are classified as power integrity (PI) and signal integrity (SI) become increasingly obvious in the package when the circuits work in the environments of high speed and high frequency. In this paper, the push-push voltage controlled oscillator (VCO)...
Technology of electrical characteristics extraction about FPC is proposed in this study. It makes use of the basic concepts of transmission line to derive the method of dielectric extraction.
Nowadays, ICs work in high speed and high frequency environments, the effects that package brings has become more and more obvious. These effects can be classified as signal integrity (SI) and power integrity (PI). In this paper, A VCO detector circuit with broadband and sensitivity characterizations is designed and used to evaluate on-package DC IR-drop and signal-integrity. The package structure...
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