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This paper describes the thermo-mechanical design of an advanced zero-level capping technology used for packaging of a MEMS die. The package approach uses Intermetallic Compound (IMC) bonding to seal the MEMS die with a cap, and uses Through Silicon Via's (TSV) to provide the electrical connections from the MEMS die to the second level substrate (LTCC or PCB). Advanced FEM based thermo-mechanical...
Unobtrusive and continuous measurement of body parameters such as activity, movement, heartbeat, temperature and oxygen level in blood offers many opportunities in the health and fitness area: distant patient monitoring, rehabilitation support, activity stimulation, improved training programs in sports and even sleep management become possible. Enablers are small wireless body sensors sending the...
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