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This paper reports a method of measuring the on-chip thermal stress for silicon resonant accelerometer (SRA). This method could be used to evaluate the stress-temperature characteristic of SRA, and that would help to focus the problems exist in SRA. Clamp-clamp Double Ended Turning Fork resonator is used as a basic measurement unit. Analysis of the accuracy and noise in stress measurement is given...
In this paper we present the recent improvement of a silicon micro-mechanical vibrating beam accelerometer (SVBA) which combine the advantage of low cost of silicon MEMS fabrication technology, small size vacuum wafer level package, low noise low power application-specific integrated oscillation circuit and digital frequency demodulation technology. Under room temperature, it has achieved bias instability...
This paper demonstrates a silicon resonant accelerometer which consists of a MEMS structure and an ASIC readout circuit. The MEMS sensor is fabricated in an 80-µm thick SOI process with a wafer level vacuum package. For noise reduction, several techniques are employed during the circuit design. And in order to reduce the temperature drift due to self heating, the power consumption is carefully limited...
MEMS gyros have sensitivity to acceleration due to asymmetry of their mechanical designs and/or micromachining inaccuracies. This paper describes a tactical grade MEMS gyro with superior acceleration rejection. The MEMS gyro structure has two proof masses and 12 modes. The effects of low-order modes on the gyro were studied by theory analysis and vibration experiments. The gyro modes were reordered...
The implementation of the dual-mass MEMS vibratory gyroscope in device-level vacuum packing was presented. The electrostatic actuation and capacitive sensing methods were adopted in electrical design of gyroscope. The self-resonance drive circuit with automatic gain control was employed in the drive closed-loop, and the open loop detect circuit was used. In order to reduce environment impact on the...
The study of nonlinear oscillation characteristics of MEMS resonator is important, which affects the performance of resonator and other MEMS devices. The MEMS resonator studied in this paper is electrostatic MEMS resonator which composed of DETF and combs. The linear spring constant and nonlinear spring constant of DETF are derived with energy method, and the nonlinear dynamics model is established...
A micromechanical silicon resonant accelerometer (SRA) with micro leverage mechanism amplifying the inertial force is presented. SRA consists of a pair of double-ended tuning forks (DETF), a proof mass and a micro lever mechanism. Firstly, the relation between frequency shift and applied force of DETF is modeled with the classical Bernoulli-Euler beams theory and then simulated by the finite element...
The silicon microgyroscopes are very sensitive to the residual stresses, which degrade the microgyroscopes performance. This study used finite element analysis to simulate the residual stresses induced during the packaging process. The silicon microgyroscope is fabricated with SOG (silicon-on-glass) technology and packaged with ceramic packages. FEM simulation based on a simplified structure of the...
In this paper, we present work on the design, fabrication, readout technique and vacuum packaging of z-axis gyroscopes. A vacuum package that houses the gyroscope and its control electronics has bee built and tested. The entire gyroscope package including control electronics is approximately phi42 times 24mm in dimensions. This vacuum packaged gyroscope has a scale factor of 19.8mV/deg/sec with a...
Canceling and minimizing quadrature error is the key to improve the performance of MEMS gyroscopes. This paper addresses how to design suspension springs to decrease the quadrature error which induced with manufacture asymmetric. According to the stiffness matrix of suspension spring, the relationship among quadrature error, terms of stiffness matrix and width mismatch was put forward. The off-diagonal...
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