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in this work we analyze, by means of 3D electromagnetic simulations, the accuracy limitations of mm-wave probe-level calibrations. The field coupling of the unshielded probe-wafer transition is the considered source of calibration inaccuracy when changing substrate between calibration and measurements. The problem of calibration transfer is first schematized in terms of error box analysis. After,...
In this contribution we review the challenges and possible solutions to achieve accurate s-parameters and power calibration in the (sub)mm-wave bands. A numerical and experimental analysis of multimode propagation over co-planar transmission lines, used during the calibration process, is described. The losses and coupling effects arising from the unwanted propagating modes are analysed by means of...
In this contribution, we propose the use of artificially engineered dielectrics to enhance the front to back ratio of an on-chip printed antenna at 300 GHz. These artificial dielectrics (AD) are anisotropic in nature and are realized by introducing periodic metallic inclusions in the host substrate. Due to the anisotropy and the small physical thickness of this equivalent medium, surface wave efficiency...
In this contribution we present a numerical and experimental analysis of the multimode propagation over coplanar transmission lines, in order to define guidelines for substrate selection to achieve accurate wafer-level (sub)mm-wave calibrations. Losses and coupling effects resulting from the multiple propagating modes on transmission lines conventionally employed for probe-level calibrations, are...
An integrated waveguide realized on (high resistivity) silicon using an IC-compatible process is reported in this work. The manufacturing process flow is based on substrate transfer technique and KOH etching, giving the resulting waveguide a trapezoidal cross-section. For this structure, the analysis of the propagating modes described here shows that it is possible to define a TE10-like mode, whose...
In this paper we compare two low cost solutions, e.g. Rogers 5880LZ laminate and a single mask IC processed fused silica wafer, for the implementation of mm-wave antennas. The design, manufacturability and performance of the structures are compared for the wireless HD communication standard. Moreover, the use of ribbon cord bonding is presented and evaluated in terms of its performance for mm-wave...
In this letter, we report, for the first time, a silicon-filled integrated waveguide based on a two mask integrated circuit (IC) process and substrate transfer technique. The fabrication process offers a high degree of control and repeatability on the device geometrical dimensions. Waveguide structures with cutoff frequencies of 35, 50, and 77 GHz were designed and fabricated. In the fundamental TE...
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