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This paper presents a method to model external capacitors behavior face to continuous and transient events. Temperature and the physical dimensions of the capacitors have been considered in order to predict Electromagnetic Compatibility performances of an equipment or a system. The different tests were performed on ceramic capacitor series X7R from Murata. A model has been developed in Verilog-A....
Direct Electrostatic Discharge (ESD to connectors pins is used to evaluate the system level susceptibility. Nevertheless, it is difficult to determine accurately the sensitive areas. Indeed, the propagation of an ESD through a PCB is still very difficult to predict even for a simple system. The lack of models at both IC and PCB levels and the limited computational resources force to simulate the system...
Driver circuits using high side switches, are commonly used in electronic applications. A challenging aspect of the integrated circuit design of such driver circuits comes from the control of the state of the circuit with high reliability when it is under harsh electrical conditions. It includes safe operations and predictable behavior under high level of Electromagnetic Interference (EMI). The typical...
In this paper the susceptibility of a Frequency-to-Voltage Convertor (FVC) to harsh automotive EMC/ESD environment using different system level ISO pulses are investigated by circuit simulations. A simplification methodology of power tree is presented and used for simulation acceleration. We evaluated the performance of the on-chip FCV under several different standard ISO pulses. As the results, we...
inside the car, all integrated circuits “IC” have to be optimized to survive against severe external aggressions. The noise generated by each activity inside each IC must be low enough, to not disturb the environment. As known nowadays, DC-DC converters can significantly impact the Electromagnetic Compatibility “EMC” performances, and mainly the emission ones. Unfortunately, simulation with linear...
Inside the car, all integrated circuits “IC” have to be optimized to survive against severe external aggressions. The noise generated by each activity inside each IC must be low enough, to not disturb the environment. As known nowadays, DC-DC converters can significantly impact the Electromagnetic Compatibility “EMC” performances, and mainly the emission ones. Unfortunately, simulation with linear...
This paper presents an analysis of the high frequency disturbances from switching operation in a SoC (System on Chip) Buck converter for EMC (Electromagnetic Compatibility) performance improvement. The impact of key design parameters is handled with an analytic approach, allowing Conducted Emission (CE) spectrum prediction.
In particular applications, integrated circuits (ICs) have to be designed to guarantee safe operations during severe electromagnetic aggressions stresses such as Direct Power Injection (DPI). Unfortunately, the simulation of functional failures during DPI events remains very challenging for analogue products due the large frequency domain and to the lack of models for internal parasitic coupling....
Often in automotive applications, a well optimized board with decoupling capacitors in proximity of the Integrated Circuit is used to improve EMC performances in system level. With increased safety concerns on mechanical vibrations that leads to lost interconnections of components, there is demand to have a complete solution inside the IC.
This work evaluates the susceptibility of a bandgap voltage reference to high electromagnetic interference superimposed at direct power injection on power supply and the majority carriers injection on substrate phenomena (typically observed during Bulk Current Injection, BCI). The investigation shows the significant impact of input pair of OTA, and the isolation connection of components on voltage...
This work evaluates how reducing the conducted emission of battery line of an alternator regulator by reducing substrate majority carrier injection of a charge pump circuitry. The investigation shows the significant impact of substrate Nwell junction (PN junction) of poly poly capacitors on conducted emission on battery input /output during charge pumping. When Nwell layer of poly-poly capacitors...
In particular cases, system level stresses such as EMC stress (Direct Power Injection, Bulk Current Injection, and Radiated Field) and ESD gun stress are directly applied to the integrated circuits with no external protections [1]. Consequently, the integrated circuits have to be optimized to survive against severe external aggressions but also to ensure normal operations during the electromagnetic...
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