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In this paper, we show that using the relation between the inductance matrix and the capacitance matrix in a homogeneous medium to extract the coupling capacitance in a through silicon via (TSV) array is inaccurate. This is because this relation assumes a lossless, homogeneous surrounding medium. We show that this model can cause an error up to 70% in coupling capacitance compared to Q3D extractor...
This paper presents a novel wireless through silicon via (TSV) communication structure based on near-field inductive-coupling. The proposed system uses a spiral inductor built using TSV technology. The electrical performance obtained from EM-based S-parameter simulations for different number of turns and configurations are presented. The proposed wireless TSV shows good coupling coefficient. A closed...
This paper presents a new architecture for on-chip spiral inductors, based on through silicon via (TSV) technology. A highly accurate closed form expression for the proposed TSV-based spiral inductor equivalent inductance is presented. This closed form is the first in literature. Moreover, this form is verified against a large number of EM simulations for different setups and shows excellent agreement...
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