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Power saving techniques and associated thermal management are inevitable for present day smartphones. Smartphones employ thermal feedback (temperature at key locations) based dynamic power management strategies to maintain the system temperature in the desired range. It is challenging to simulate the thermal behavior of such a system as running a computational fluid dynamics system with control logic...
Printed circuit boards (PCB) are found in almost all electronic devices. During manufacturing and field operation, these PCBs are subjected to different loads, which cause stresses and deformations. Excessive stresses and deformations of PCB can lead to system failure. Thermo mechanical simulation helps to predict stress distribution in manufacturing and operational condition. PCB object consists...
Electronics thermal management for high power applications is crucial. Modeling is an indispensable tool to help engineers design better electronics cooling systems. An efficient transient thermal model for electronics thermal management based on singular value decomposition (SVD) is proposed. The model generation process starts with computation fluid dynamics (CFD) results of an electronics model,...
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