The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
There are a number of final finishing technologies available in the market, each with different cost and performance attributes. The unique attributes of the Selective ENIG process have made it a popular choice for mobile device and high density interconnect (HDI) applications. This hybrid final finishing process combines the benefits of both ENIG and organic solderability preservative (OSP) processes...
The failure ratios of the three typical time-dependent dielectric breakdown (TDDB) failure modes, including top interface, sidewall and bottom corner areas, have been identified for a direct polishing ultra low k (ULK) dielectric Cu back-end-of-line (BEOL) structure at 40nm node. The Cu surface roughness of the metal lines, and the adhesion and thickness of the metal capping layers are strongly correlated...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.