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There is an ever growing need for a fluxless chipjoin process to alleviate the difficulties associated with fluxcleaning in small gaps and to target fluxless packagingapplications such as required for advanced photonics. Moreover, a fluxless process can enable new process flows such as in-line underfill of fragile structures or acombination tack and mass reflow operations for 3D packages. This paper...
A numerical model is presented for the portion of the flip-chip joining process where liquid-state solder bumps on the substrate and on the device merge (wet) to form full interconnections. An excellent agreement is demonstrated between calculations and experimental data for the accompanying reduction as a function of time in the device-substrate gap height resulting from the wetting process. The...
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