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Interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Ni/Cu substrate have been investigated after reflow and high temperature storage. The reflow peak temperature at 265degC and a total duration time of 6 minutes were used. The duration time at the peak temperature of the reflow process was approximately 2 min. The aging temperature was 150degC and the duration time was 100 h,...
The mechanical bending test results, as well as the modeling and calculation data were presented in this study to characterize the solder joint reliability. Bending test was completed simply by loading a series of displacements on the FR-4 printed circuit board (PCB) with devices and solder joints in single direction. A special bending tester that can control displacement exactly by a cam system was...
The present work was mainly focused on the evolution of interfacial intermetallic compounds (IMCs) between solder and Au/Ni/Cu metallization in PBGA Sn-Ag-Cu solder balls during thermal cycling test. The PBGA package was assembled on the FR-4 board using a typical surface mounting assembly process, and the thermal cycling was carried out in a systematic manner for two different temperature cycling...
Solder joints of Sn-37Pb, Sn-3.5Ag, Sn-4.0Ag-0.5Cu and Sn-8Zn-3Bi (all compositions in wt%) were tested by means of isothermal low cycle mechanical fatigue at room temperature over a wide range of strain ranges (1%-10%). The eutectic Sn-37wt%Pb was used as a reference. Single lap shear samples with solder joints 0.45mm in height and 1.6mm in diameter were used. The testing was executed in a displacement-controlled...
The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260degC for 2 minutes. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference. Two types of intermetallic compounds (IMC) were found in the solder matrix of the Sn-0.4Co-0.7Cu alloy, namely coarser CoSn2 and finer Cu6 Sn5 particles,...
The Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-immersion Au metallization exhibited different interfacial morphology after high temperature storage (HTS) testing at 150degC. Ni3Sn4 intermetallic compounds (IMCs) were found in the Sn-Ag system, while in the Sn-Ag-Cu system, spalling grains of (Cu,Ni)6Sn5 IMC were observed after long aging, along with a thick (Ni,Cu)3Sn4 IMC layer which adheres...
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