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Given the recent interest in power delivery design for the Internet of Things (IoT), current work aims to design a packaged power delivery solution for IoT. The power inductor takes up a large amount of the area in such an implementation. Planar power inductors are preferred for fabrication simplicity and cost. However, air core inductors do not have sufficient area efficiency for IoT solutions, necessitating...
In this paper, yield improvement methodology is proposed for RF substrates with embedded RF passive circuitry. The proposed methodology introduces a concept of package-chip co-design and on-chip calibration of active circuitry for the yield improvement of off-chip passive embedded RF filters. RF receiver architecture for the package-chip co-design and on-chip calibration technique is presented. Using...
After providing an overview of the state-of-the-art in power distribution design and modeling, this paper focuses on return path discontinuities (RPDs) for I/O signaling. After briefly describing their importance in the context of simultaneous switching noise, a specific case of RPD based on via discontinuities is discussed in detail in the context of both the frequency- and time-domain waveforms...
Full-wave EM simulations are computationally expensive given the complexity of packaging structures in modern mixed signal systems. Fast methods such as the transmission matrix method are inaccurate as they do not model discontinuities such as metal edges and gaps. In this paper, simple models for the edge effect and gap coupling are developed for the finite difference frequency domain method. Results...
The ever increasing power requirements of processors and application specific integrated circuits (ASICs) impose stringent requirements on the design of power distribution networks (PDNs). This paper highlights a power analysis methodology and discusses the decoupling requirements of high performance components. The advantages of embedded package capacitors in core and I/O decoupling will be highlighted
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