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We have developed a new 3-D hybrid integration technology of complementary metal-oxide-semiconductors, microelectromechanical systems (MEMS), and photonics circuits for optoelectronic heterogeneous integrated systems. We have overcome the fabrication difficulties of optoelectromechanical and microfluidics hybrid integration. In order to verify the applied 3-D hybrid integration technology, we fabricated...
To realize very high performance computing system, we have proposed a novel opto-electronic 3-D LSI in which both electrical and optical devices are integrated. For realizing such opto-electronic 3-D LSI, through Si photonic via (TSPV) is indispensable for vertical light transmission. In this work, we fabricated the TSPV comprising Si core and epoxy cladding. We measured near field patterns (NFP)...
We proposed 3D heterogeneous opto-electronic integration technology for system-on-silicon (SOS). In order to realize 3D opto-electronic integrated system-on-silicon (SOS), we developed novel heterogeneous integration technology of LSI, MEMS and optoelectronic devices by implementing 3D heterogeneous opto-electronic multi-chip module composed with LSI, passives, MEMS and optoelectronic devices. The...
We demonstrate mode switching in tandem quasi-stadium laser diodes. Switching is achieved by optical injection between lasing in the cavity axis and the closed ring trajectory of a quasi-stadium laser resonator.
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