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A complete chip-package-board co-design of bonding transition for a quad flat pack nonlead (QFN) package was conducted from dc to millimeter wave frequencies. First, two ground paths in parallel were used to improve the operating frequency of the commercially available QFN to 50 GHz. Owing to its rectangular cross section, ribbon bond has a better form factor than the corresponding round wire bond...
An interconnect transition within the plastic mold is formed between the output ports of the IC sitting on top of a Quad Flat Non-leaded (QFN) package and the nearby I/O leads of the package. This paper describes the design and development of a cost-effective interconnect transition structure for improving the operating frequency of the package up to millimeter-wave range. In addition to adopting...
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