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A major barrier to improved process control in electronic circuit-pack assembly is the lack of robust, high-speed, cost-effective sensing technologies. As part of an overall process-control system, AT&T's Little Rock (Arkansas) Operations Center is implementing a new three-dimensional (3-D) imaging system that measures the amount of solder paste applied to circuit boards. The system uses an imaging...
The automation of inspection tasks has always been of prime concern to process engineers. Until recently, the technology was not available to automate anything but the simplest tasks. With advances in machine vision and computer technologies, many visual inspection tasks can now be automated. This paper describes an AT&T development that can be used as an efficient tool for automating the inspection...