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Compression deformation property, which is directly related to an ability of surface compliant bonding and hermetic sealing, of low-temperature wafer bonding using sub-micron Au particles was studied. Wafer bonding test using 0.3 μm particles demonstrated excellent hermeticity with He leak rate better than 1 × 10−9 Pa·m3/s even on a substrate with a surface topography of a few μm. Cross-section SEM...
Low-temperature wafer bonding using sub-micron gold particles was investigated. Wafer-level pattern transfer method has also been developed to enable patterning on wafers with fragile structures such as MEMS devices. Sub-micron Au particle patterns with a width of 20 µm – 60 µm and a height around 20 µm were formed on 100mm-diameter glass wafers by means of wafer-level processing using photolithography...
Low-temperature wafer bonding using sub-micron gold particles was investigated. For more flexible bonding pattern deposition, wafer-level pattern transfer method has been developed to enable patterning on fragile structures such as MEMS devices. Sub-micron Au particle patterns with a width of 20 μm–60 μm and a height around 20 μm were formed on 100mm-diameter glass wafers by means of wafer-level processing...
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