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Thick film hybrid integrated circuit is a product of thick film technology and semiconductor technology. Because of some outstanding advantages, such as high reliability and high integration, hybrid integrated circuit has been gradually applied to aerospace electronic equipment. The situation of unstable electrical performance caused by individual parameters exceed standard in the hybrid integrated...
The degradation of Al wire bonding strength of MOSFET devices under thermal shock test was investigated. In the thermal shock test, two kinds of Al wires (250um/380um) in different packaging have been studied. Degradation behaviors of the Al wire bonds during thermal shock tests were evaluated by measuring pull stresses and comparing these values with those of the original Al wire bonds. In this work...
Based on the special analysis of the special requirements of electronic products, the creep damage of typical tin-lead solder is more complicated in the harsh environment, and the life and reliability of aerospace products are more important. In addition, based on the typical creep damage cases of aerospace electronic products, this paper elaborates the creep rupture mechanism of solder joint in aerospace...
LEDs are replacing incandescent bulbs in many fields particularly those requiring durability and low power consumption. The flexible packaged LED module could apply Surface light source, it is very useful in some special occasion. In some of these applications, as automotive and outside of the buildings, flexible packaged LEDs modules were exposed in extreme temperature and humidity conditions. In...
The multiferroic Ba 0.7 Sr 0.3 TiO 3 (BSTO)–Ni 0.8 Zn 0.2 Fe 2 O 4 (NZFO) nanofibers with different molar ratios were prepared by electrospinning method. After annealing at 700°C, the composite nanofibers showed highly crystalline structure with no impurity phase. The fibers before and after heat treatment had high aspect ratios, and the fibrous...
With the increasing power of a single LED chip and the requirement of more LED chips in one package for high illumination, the conventional LED lamps with the surface mound device-printed circuit board (SMD-PCB) package have met some troubles. In the SMD-PCB package, there has too many thermal interfaces and hence has very high thermal resistance from chip to heat sink, which bring the high junction...
A new die-attach process was presented for the multi-chip LED module, and the related bonding tool for the LED module was also designed. With the new bonding process and the novel bonding tool, 21 LED chips have been attached onto a single substrate within one bonding process. The investigation of bonding chips' appearance and thickness of interface layer were carried out to evaluate the die-attach...
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