The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Electromigration (EM) is a growing concern in on-chip interconnects, particularly in the computing and automotive domains. EM can cause wire resistances in a circuit to increase, which may result in circuit performance failure within the lifetime of a product. Classical circuit-level EM models have two drawbacks: first, they do not accurately capture the physics of degradation in modern copper dual-damascene...
Modern power grids use via arrays to connect wires across metal layers. These arrays are susceptible to electromigration (EM), which creates voids under the vias, potentially causing circuit malfunction. We combine the effect of via redundancy with models that characterize the effect of via array geometry on thermomechanical stress, and determine how the choice of via arrays can affect EM-induced...
Electromigration (EM), a growing problem in on-chip interconnects, can cause wire resistances in a circuit to increase under stress, to the point of creating open circuits. Classical circuit-level EM models have two drawbacks: first, they do not accurately capture the physics of degradation in copper dual-damascene (CuDD) metallization, and second, they fail to model the inherent resilience in a circuit...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.