The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The fabrication, electrical characterization and reliability study of copper through-silicon via (TSV) is reported. All the fabrication steps needed in this process have a process temperature < 250°C. The copper TSVs have two distinct features: tapered via profile and partial filling of the vias. Besides the single Kelvin cell TSVs, daisy chains having up to 1400 TSVs were also fabricated and characterized...