The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The advances of flip-chip technology have driven the development of both underfilling processes and underfill materials. With the flip chip scaling to fine pitch and small gaps, nano-sized filler has become an alternative choice to conventional micron-sized filler for underfill applications. On one hand, due to the large surface area of the nanofiller, polymer based nanocomposites exhibite improved...
The novel underfill material with low coefficient of thermal expansion was prepared by cyanate, epoxy, polyimide and silica filler. Rheological properties, curing behaviors, mechanical and thermal properties of the resultant materials were investigated by rheometer, DSC, FTIR, TMA and DMA, respectively. The results showed that the modification of cyanate resin and its copolymer with silica filler...
Anhydride and amine epoxy systems are widely used as hardeners in underfill materials for flip chip packaging. A comparison was made between these two systems in order to evaluate the comprehensive performance of the resulting underfill. It was found that the addition of multi-size silica particles has little effect on the curing reaction of the epoxy mixture while a significant effect on increasing...
In this paper, two kinds of silica prepared via dry chemical route (SiO2-d) and wet chemical (SiO2-w) method are used as potential CTE reducing fillers. The influence of adding silica on composite underfills' properties such as CTE, modulus, and glass transition temperature (Tg) are investigated. The addition of silica fillers could reduces CTE and improves the modulus of the epoxy. Compared with...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.