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In this paper design aspects and challenging packaging solution of a monolithic 3D force sensor will be presented. The previously developed design and process flow (Vázsonyi et al. 123–124:620–626, 2005; Molnár et al. 90:40–43, 2012) were improved by an additional hybrid wafer bonding step of simultaneous anodic and metal bonding processes. This electrostatic force assisted metal bonding can ensure...
Wireless Si 3D force sensor made by MEMS technology was integrated and tested on the sidewall of a tyre using flexible rubber repair patch (patent pending) in order to monitor the deformation of the rotating tyre in automotive applications. Finite element simulation was used to determine the optimal positioning of the sensor structure. Power supply and wireless communication is based on inductive...
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