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In recent years, density growth of VLSI system brings about increase of power consumption and routing delay, which comes to be a serious issue. Three-Dimensional (3D) IC technology is drawing attention as a solution. A 3D-FPGA is a new class of FPGA using the TSV (through silicon via) technology, one of 3D-IC technologies; the 3D-FPGA uses 3D switch blocks (SBs) in place of traditional 2D-SBs. In...
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