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Large area OLEDs aimed at lighting applications should provide homogeneous luminance—homogeneity is one of the quality metrics of such devices. Local light generation depends on both the local temperature and the local voltage drop across the light emitting polymer(s) in the device. Therefore the thermal and electrical engineering of OLEDs aimed at lighting applications is critical. Due to the large...
This paper presents a simulation framework that considers the self-heating of digital blocks and thus helps designers, verification engineers and test engineers to predict or detect thermally sensitive regions and possible signal integrity issues in complex digital designs.
Besides their electrical properties the optical parameters of LEDs also depend on junction temperature. For this reason thermal characterization and thermal management plays important role in case of power LEDs, necessitating tools both for physical measurements and simulation. This paper deals with the combined electrical, thermal and optical characterization and multi-domain modeling of power LEDs...
In recent years great effort has been put into development of organic light emitting diodes (OLEDs) worldwide. Among many concerns of developers is heat-removal from the thin film structure of the active layers of OLEDs which are typically realized on low thermal conductivity substrates such as glass or polymer foils. The other issue is to provide the OLEDs with transparent, yet high electrical conductivity...
Regarding thermal issues in digital IC design a major concern is how timing integrity is affected by the elevated junction temperature and temperature gradients on the chip surface. To predict this in a thermal aware design process one needs a dedicated simulation tool in which the logic simulation of the circuit is coupled to the thermal simulation of the chip and its environment. This paper presents...
This paper proposes a method for yield enhancement in digital integrated circuit manufacture using a temperature dependent logic simulation tool. In an industrial environment the time slot dedicated to the logic testing of a single integrated circuit needs to be as short as possible in order to boost production. During this short period thermally induced errors might remain hidden due to long thermal...
In this paper we aim at highlighting different aspects of thermal testing of AC LEDs, especially of retrofit LED lamps which are directly driven from the AC mains supply. The main focus is the concept of thermal impedance applied for AC driven LEDs and the AC heating power. The paper gives an overview of the different representations of the thermal impedance then provides estimates of the AC power...
This paper presents a novel logi-thermal simulator architecture. A logi-thermal simulator encorporates a logic and a thermal core in strong coupling. It is capable of calculating the self-heating of digital blocks and is able to account for the consequences of temperature change by implementing the delays of the blocks as a function of the temperature. The simulator architecture presented is able...
Different high-end white power LEDs from different LED vendors were studied. The aim of the study was to find the optimal choice of LEDs and thermal management solutions for a street-lighting application. The primary concern was the (real) junction-to-heatsink thermal resistance of the LED or LED assembly and the real junction temperature and the actual light output of the individual LEDs under test...
There are several ways to define the junction-to-case thermal resistance; however, it is rather challenging to characterize the heat-flow in a package by a single number in an accurate and reproducible way. For many power package families such as TO-type packages the thermal transient testing and the so-called dual interface method can give reliable results. The diverging point of structure functions...
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