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The bonding layer in the light emitting diode (LED) device of flip-chip or vertical structure is the most critical part to the device performance since it supports the electrical and thermal interconnection between the chip and its carrier. Therefore, the chip bonding process has become one of the major issues in the practical manufacturing. In this study, we developed a novel bonding technique using...
With the increasing demand of high-power light-emitting diode (LED), multichip modules have made great progress. A die-attach layer as the first-level packaging has a most significant impact on the thermal performance of a power module. In this paper, we introduce a novel die-attach material, nanosilver paste, which can be used for connecting multichips on the substrate. This nanosilver paste has...
Low temperature sintered nano-silver paste becomes a potential alternative in green electrical packaging because of its higher thermal and electrical conductivity than conventional solders. It can be used for connected chips that require high temperature operation, such as high power LED and power electronics modules, etc. During service, alternating shear strain, even thermal fatigue failure will...
Heat dissipation for packaging high-power light-emitting diodes is critically important to performance and reliability of LED lighting modules. The first thermal interface encountered by the heat flow is a die-attach material between the diode chip and its substrate. In this study, three different types of die-attach materials were used to construct 1-Watt GaN LED single-chip modules: a silver epoxy...
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