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An interconnect transition within the plastic mold is formed between the output ports of the IC sitting on top of a Quad Flat Non-leaded (QFN) package and the nearby I/O leads of the package. This paper describes the design and development of a cost-effective interconnect transition structure for improving the operating frequency of the package up to millimeter-wave range. In addition to adopting...
This paper focuses on the design and development of a low-cost QFN package that is based on wirebond interconnects. One of the design goals is to extend the frequency at which the package can be used to 40–50 GHz (above the K band), in the millimeter-wave range. Owing to the use of mass production assembly protocols and materials, such as commercially available QFN in a mold compound, the design that...
In this paper, a spiral-type Marchand balun design in glass-based IPD technology has been presented. The EM simulation results show good agreement with measurements. The balun in this design has excellent return and insertion loss characteristics. In addition, it is also with good amplitude and phase balance and can achieve high CMRR performance. This balun design has been successfully employed in...
The integrated passive device (IPD) technology was currently developed for high performance, small volume or size, low cost and multi-functional integration for wireless RF front-end applications. Especially wafer level packaging technologies offer an interesting variety of different possibilities for the implementation of integrated passive components. The IPD process is made by a low-cost manufacturing...
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