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This paper presents a study of two lightweight steels, Fe-15Mn-10Al-0.8C-5Ni and Fe-15Mn-10Al-0.8C (in wt.%) where strength is dependent upon the microstructure of 2nd phase precipitates. We investigate the effects of annealing temperature from 500 °C to 1050 °C on the precipitation of ordered phases size and morphology through phase-field modelling and experimental studies based on laboratory scale...
Electromigration is a critical reliability problem in electronic industry, especially with the shrinkage and downscaling of microelectronic feature size, which results in gradual increase of current density. Carbon nanotube(CNT) doping is adopted in this paper. CNT has demonstrated high electromigration resistance. In our work, CNT doping is combined with SAC interconnects. A CNT after surfactant...
Previous works on electromigration in microelectronics devices have been reviewed, and a multi-physics EM simulation method that combines electric, thermal, atomic diffusion, and stress analysis has been described. The proposed method can be used to predict the atomic vacancy concentration distribution and void formation in metals or alloys that are subject to current loading.
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