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This paper proposes a four-phase quality function deployment (QFD) involving TRIZ thinking strategy to enhance breakthrough capabilities for preventative and proactive design in product R&D process. Continuously developed opportunities for breakthrough innovation' are highlighted. In QFD1, identified customer needs are translated into technical specifications / design requirements. QFD2 is responsible...
Worldwide demand for notebook computers has outstripped that for desktop computers. Today, notebook computer design and manufacturing is one of the most competitive of all electronic industry subsectors. Innovation and environmental friendliness (i.e., “green”) are both of increasing importance to notebook computer makers. Traditional strategies for NB design and manufacturing may be inadequate to...
For the ultra fine pitch applications, solder paste printing acts as one of the most critical step in the SMT assembly process. A review of literature indicates that solder paste printing contributes around 60% of the total process defects. One of the key factors for the performance of solder paste deposition is stencil fabrication quality. Other important factors include stencil aperture design,...
Trends in the packaging of semiconductors are towards miniaturization and high functionality. The package-on-package (PoP) with increasing demands is beneficial in cost and space saving. This study conducts the assembly of the PoP component through the stacking process. Samples are subject to thermal cycling test condition, 0°C to 100°C. The failure of samples is defined as when the measured resistance...
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