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The IEEE is currently developing a standard “Electrical characterization of printed circuit board and related interconnects at frequencies up to 50GHz” (IEEE Std P370). As part of the development of this standard, a technique (or techniques) is (are) required in order to provide a measure of the goodness-of-fit between measured and simulated data for a structure or between different measurements or...
This paper describes a novel method of modeling the differential via on multilayered printed circuit boards (PCBs) used in high-speed digital designs based on the analytical equations for characteristic impedance and effective dielectric constant. In the absence of measured or electromagnetic simulated data traditionally needed to extract these parameters, this method can quickly and efficiently predict...
This paper investigates the impact of return path discontinuities on both signal and power integrity of high speed interconnects. A test board is built for the purpose and 4 different configurations are analyzed and correlation between measurements and simulations (coming from a full wave 3D EM field simulator) results is also presented. Both time and frequency domain results are analyzed and design...
Signal integrity parameters associated with signal distortion, power plane integrity and signal transmission quality (jitter) are consider for prognostics and health monitoring (PHM) in high-speed digital applications. A key benefit of utilizing signal integrity parameters for PHM is that uncertainty is reduced as the very signals, their return paths, and their power and ground networks are used for...
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