The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, the effect of the curing process on the warpage of an encapsulated electronic package is considered by using a coupled chemical-thermomechanical modeling methodology. A cure-dependent constitutive model that consists of a cure-kinetic model, a curing- and chemical-aging-induced shrinkage model, and a degree of cure-dependent viscoelastic relaxation model was developed and implemented...