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BGA device is always inefficient for its solder joints, of which part the interface intermetallic compounds (IMC) is most likely to crack. What's more, interfacial reactions are becoming more complex these days as the lead-free alternative becoming an urgent requirement for electronic industry and various materials being applied in electronics packaging application. Taking account of the above reasons,...
To enhance real-time performance of the motion control level communication, the real-time performance and feasibility of Ethernet application in the motion control level is analyzed. Then, this paper proposes an optimization method for Ethernet-based real-time communication of Computer Numerical Control (CNC) system. By this method, the transmission delay in Ethernet is obtained in the time synchronization...
To protect the environment and enhance the human health, the lead-free process is speeded up rapidly in recent years. However, on the way to lead-free process, lead and lead-free materials will be used within the same mounting process for the manufacturers of electronic products. Therefore it is necessary to study the reliability of the mixed solder joints. Based on BGA device, this paper analyzes...
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