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Recently, hybrid cache architecture has become illuminated. As heterogeneous memory dies are stacked, it improves the performance of microprocessor enhanced in terms of power consumption and processing speed. This paper analyzed the hybrid cache architecture using different programs and memory types. SRAM is fixed for L1 cache memory, whereas DRAM, MRAM, and PRAM are the candidates for L2 cache memory...
Three-dimensional integration has the potential to increase integration density and to reduce communication latency of chip-multiprocessors (CMPs). However, high power density (i.e., power dissipation per unit volume) due to the high integration incurs temperature-related problems in reliability, power consumption, performance, and system cooling cost. In this paper, we propose a design-time solution...
3D integration increases chip integration density, reduces wire length, wire delay and power consumption on wires. However, increased power density causes increase of temperature, which results in the increase of leakage power consumption and performance degradation. In this paper, we propose a solution to compromise these issues on stacking cache memory on a processor core. Experimental results have...
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